LOAD LOCK Chamber (option)
LOAD LOCK預真空進樣室（可選）
Chamber with front open door
前開門蒸發腔體
Cryopump and dry pump
冷凝泵和幹泵
Multiple thermal evaporation sources or OLED sources
多個熱阻蒸發源或OLED低溫蒸發源
Max. 6” substrate
6”基片
Substrate rotation
基片旋轉
Substrate bias (option)
基片偏壓（可選）
Ion source for substrate cleaning (option)
離子源清洗基片（可選）
Substrate heating to 1000C (option)
基片加熱1000度(可選)
Crystal rate monitor and film thickness control
晶振沉積速率及膜厚控制
Manual or automatic system control
係統手動或自動控制
For deposition of metal, semiconductor and insulation materials
可沉積金屬、半導體和絕緣材料
For deposition of multi-layer or alloy film
可沉積多層膜及合金薄膜